Granted Patent
Utility
US 6,541,872 · App. 09/227,942
Multi-layered adhesive for attaching a semiconductor die to a substrate
Inventors:
Edward A. Schrock, Tongbi Jiang
Patented Case
View Patent ↗
Granted: Apr 1, 2003
Filed: Jan 11, 1999
Inventors
Edward A. Schrock
Tongbi Jiang
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.