IP Library Granted Patent US 6,543,129
Granted Patent Utility
US 6,543,129 · App. 09/801,226

Solder-bearing contacts and method of manufacture thereof and use in a solder ball grid array connector

Inventors: Joseph Cachina, Jack Seidler, James Zanolli
Patented Case View Patent ↗
Granted: Apr 8, 2003 Filed: Mar 7, 2001
Inventors
Joseph Cachina
Jack Seidler
James Zanolli
Assignee (at issue)
Teka Interconnections Systems, Inc.

This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.

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Quick Facts
Patent No.
US 6,543,129
App. No.
09/801,226
Filed
2001-03-07
Granted
2003-04-08
Kind
B2