Granted Patent
Utility
US 6,544,863 · App. 09/934,783
Method of fabricating semiconductor wafers having multiple height subsurface layers
Inventors:
John Chong, Paul C. Waldrop, Tim Davis, Scott G. Adams
Patented Case
View Patent ↗
Granted: Apr 8, 2003
Filed: Aug 21, 2001
Inventors
John Chong
Paul C. Waldrop
Tim Davis
Scott G. Adams
Assignee (at issue)
Calient Networks, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.