Granted Patent
Utility
US 6,544,880 · App. 09/332,665
Method of improving copper interconnects of semiconductor devices for bonding
Inventor:
Salman Akram
Patented Case
View Patent ↗
Granted: Apr 8, 2003
Filed: Jun 14, 1999
Inventor
Salman Akram
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.