Granted Patent
Utility
US 6,544,897 · App. 10/001,332
Method for forming a vertical edge submicron through-hole and a thin film sample with this kind of through-hole
Inventor:
Takashi Kaito
Patented Case
View Patent ↗
Granted: Apr 8, 2003
Filed: Oct 26, 2001
Inventor
Takashi Kaito
Assignee (at issue)
SEIKO INSTRUMENTS INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.