Granted Patent
Utility
US 6,545,352 · App. 10/077,318
Assembly for mounting power semiconductive modules to heat dissipators
Inventor:
Thomas W. Ruckdeschel
Patented Case
View Patent ↗
Granted: Apr 8, 2003
Filed: Feb 15, 2002
Inventor
Thomas W. Ruckdeschel
Assignee (at issue)
ERICSSON GMBH
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.