Granted Patent
Utility
US 6,548,409 · App. 10/076,395
Method of reducing micro-scratches during tungsten CMP
Inventors:
Shyh-Dar Lee, Chun Nien
Patented Case
View Patent ↗
Granted: Apr 15, 2003
Filed: Feb 19, 2002
Inventors
Shyh-Dar Lee
Chun Nien
Assignee (at issue)
Silicon Integrated Systems Corp.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.