Granted Patent
Utility
US 6,548,893 · App. 09/898,567
Apparatus and method for hermetically sealing and EMI shielding integrated circuits for high speed electronic packages
Inventors:
Yu-Ju Chen, Hui-Hsien Wu
Patented Case
View Patent ↗
Granted: Apr 15, 2003
Filed: Jul 3, 2001
Inventors
Yu-Ju Chen
Hui-Hsien Wu
Assignee (at issue)
Big Bear Networks, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.