Granted Patent
Utility
US 6,549,028 · App. 09/630,972
Configuration and process for testing a multiplicity of semiconductor chips on a wafer plane
Inventor:
Carsten Ohlhoff
Patented Case
View Patent ↗
Granted: Apr 15, 2003
Filed: Aug 2, 2000
Inventor
Carsten Ohlhoff
Assignee (at issue)
Infineon Technologies AG
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.