Granted Patent
Utility
US 6,549,413 · App. 10/082,914
Tape ball grid array semiconductor package structure and assembly process
Inventors:
Marcos Karnezos, Yong-Bae Kim
Patented Case
View Patent ↗
Granted: Apr 15, 2003
Filed: Feb 26, 2002
Inventors
Marcos Karnezos
Yong-Bae Kim
Assignee (at issue)
ChipPAC, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.