Granted Patent
Utility
US 6,549,550 · App. 09/781,995
Method for reducing thermal loss and providing mechanical compliance in a semiconductor package and the semiconductor package formed therefrom
Inventors:
Mindaugas F. Dautartas, Joseph Michael Freund, John M. Geary, George J. Pryzbylek
Patented Case
View Patent ↗
Granted: Apr 15, 2003
Filed: Feb 14, 2001
Inventors
Mindaugas F. Dautartas
Joseph Michael Freund
John M. Geary
George J. Pryzbylek
Assignee (at issue)
TriQuint Technology Holding Co.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.