IP Library Granted Patent US 6,551,844
Granted Patent Utility
US 6,551,844 · App. 09/224,673

Test assembly including a test die for testing a semiconductor product die

Inventors: Benjamin N. Eldridge, Igor Y. Khandros, David V. Pedersen, Ralph G. Whitten
Patented Case View Patent ↗
Granted: Apr 22, 2003 Filed: Dec 31, 1998
Inventors
Benjamin N. Eldridge
Igor Y. Khandros
David V. Pedersen
Ralph G. Whitten
Assignee (at issue)
FormFactor, Inc.

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Quick Facts
Patent No.
US 6,551,844
App. No.
09/224,673
Filed
1998-12-31
Granted
2003-04-22
Kind
B1