Granted Patent
Utility
US 6,551,872 · App. 09/642,140
Method for making integrated circuit including interconnects with enhanced electromigration resistance using doped seed layer and integrated circuits produced thereby
Inventor:
James A. Cunningham
Patented Case
View Patent ↗
Granted: Apr 22, 2003
Filed: Aug 18, 2000
Inventor
James A. Cunningham
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.