Granted Patent
Utility
US 6,552,875 · App. 09/620,791
Suspension design for improving the curing process for head bonding application and method for same
Inventors:
Hienminh Huu Le, Tzong-Shii Pan
Patented Case
View Patent ↗
Granted: Apr 22, 2003
Filed: Jul 21, 2000
Inventors
Hienminh Huu Le
Tzong-Shii Pan
Assignee (at issue)
International Business Machines Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.