Granted Patent
Utility
US 6,554,949 · App. 10/244,548
Wafer demount receptable for separation of thinned wafer from mounting carrier
Inventors:
Bhola De, Daniel Stofman
Patented Case
View Patent ↗
Granted: Apr 29, 2003
Filed: Sep 17, 2002
Inventors
Bhola De
Daniel Stofman
Assignee (at issue)
ANADIGICS, INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.