Granted Patent
Utility
US 6,555,763 · App. 09/397,016
Multilayered circuit board for semiconductor chip module, and method of manufacturing the same
Inventors:
Koki Hirasawa, Teruo Ono
Patented Case
View Patent ↗
Granted: Apr 29, 2003
Filed: Sep 15, 1999
Inventors
Koki Hirasawa
Teruo Ono
Assignees (at issue)
Fuchigami Micro Co., Ltd.
NEC Compound Semiconductor Devices, Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.