Granted Patent
Utility
US 6,555,899 · App. 09/687,541
Semiconductor package leadframe assembly and method of manufacture
Inventors:
Young Suk Chung, Sung Sik Jang, Jae Hak Yee
Patented Case
View Patent ↗
Granted: Apr 29, 2003
Filed: Oct 13, 2000
Inventors
Young Suk Chung
Sung Sik Jang
Jae Hak Yee
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.