Granted Patent
Utility
US 6,558,978 · App. 09/993,466
Chip-over-chip integrated circuit package
Inventor:
John McCormick
Patented Case
View Patent ↗
Granted: May 6, 2003
Filed: Nov 5, 2001
Inventor
John McCormick
Assignee (at issue)
LSI Logic Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.