Granted Patent
Utility
US 6,559,048 · App. 09/870,851
Method of making a sloped sidewall via for integrated circuit structure to suppress via poisoning
Inventors:
Yong-Bae Kim, Philippe Schoenborn, Kai Zhang
Patented Case
View Patent ↗
Granted: May 6, 2003
Filed: May 30, 2001
Inventors
Yong-Bae Kim
Philippe Schoenborn
Kai Zhang
Assignee (at issue)
LSI Logic Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.