IP Library Granted Patent US 6,559,535
Granted Patent Utility
US 6,559,535 · App. 09/781,423

Lead structure for sealing package

Inventors: Robert B. Crispell, Mark J. Nelson
Patented Case View Patent ↗
Granted: May 6, 2003 Filed: Feb 13, 2001
Inventors
Robert B. Crispell
Mark J. Nelson
Assignee (at issue)
Agere Systems Inc.

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Quick Facts
Patent No.
US 6,559,535
App. No.
09/781,423
Filed
2001-02-13
Granted
2003-05-06
Kind
B2