Granted Patent
Utility
US 6,560,122 · App. 09/967,676
Chip package with molded underfill
Inventor:
Patrick Weber
Patented Case
View Patent ↗
Granted: May 6, 2003
Filed: Sep 28, 2001
Inventor
Patrick Weber
Assignee (at issue)
HESTIA TECHNOLOGIES, INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.