Granted Patent
Utility
US 6,562,222 · App. 09/980,947
Copper electroplating liquid, pretreatment liquid for copper electroplating and method of copper electroplating
Inventors:
Jyunnosuke Sekiguchi, Syunichiro Yamaguchi
Patented Case
View Patent ↗
Granted: May 13, 2003
Filed: Dec 5, 2001
Inventors
Jyunnosuke Sekiguchi
Syunichiro Yamaguchi
Assignee (at issue)
Nikko-Materials Co., Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.