Granted Patent
Utility
US 6,562,250 · App. 09/697,453
Method for manufacturing wiring circuit boards with bumps and method for forming bumps
Inventors:
Yutaka Kaneda, Keiichi Naito, Toshihiro Shinohara
Patented Case
View Patent ↗
Granted: May 13, 2003
Filed: Oct 27, 2000
Inventors
Yutaka Kaneda
Keiichi Naito
Toshihiro Shinohara
Assignee (at issue)
Sony Chemicals Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.