Granted Patent
Utility
US 6,562,648 · App. 09/648,187
Structure and method for separation and transfer of semiconductor thin films onto dissimilar substrate materials
Inventors:
William S. Wong, Michael A. Kneissl
Patented Case
View Patent ↗
Granted: May 13, 2003
Filed: Aug 23, 2000
Inventors
William S. Wong
Michael A. Kneissl
Assignee (at issue)
Xerox Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.