Granted Patent
Utility
US 6,562,655 · App. 09/839,288
Heat spreader with spring IC package fabrication method
Inventors:
Thomas P. Glenn, Steven Webster, Roy Dale Hollaway
Patented Case
View Patent ↗
Granted: May 13, 2003
Filed: Apr 20, 2001
Inventors
Thomas P. Glenn
Steven Webster
Roy Dale Hollaway
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.