Granted Patent
Utility
US 6,562,663 · App. 09/819,393
Microelectronic assembly with die support and method
Inventors:
Steven Scheifers, Andrew Skipor, Daniel Gamota
Patented Case
View Patent ↗
Granted: May 13, 2003
Filed: Mar 28, 2001
Inventors
Steven Scheifers
Andrew Skipor
Daniel Gamota
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.