IP Library › Granted Patent US 6,562,734
Granted Patent Utility
US 6,562,734 · App. 09/954,414

Method of filling gaps on a semiconductor wafer

Inventor: Markus Kirchhoff
Patented Case View Patent ↗
Granted: May 13, 2003 Filed: Sep 17, 2001
Inventor
Markus Kirchhoff
Assignee (at issue)
Semiconductor 300 GmbH & Co. KG

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Quick Facts
Patent No.
US 6,562,734
App. No.
09/954,414
Filed
2001-09-17
Granted
2003-05-13
Kind
B2