Granted Patent
Utility
US 6,563,133 · App. 09/635,272
Method of epitaxial-like wafer bonding at low temperature and bonded structure
Inventor:
Qin-Yi Tong
Patented Case
View Patent ↗
Granted: May 13, 2003
Filed: Aug 9, 2000
Inventor
Qin-Yi Tong
Assignee (at issue)
ZIPTRONIX, INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.