Granted Patent
Utility
US 6,563,196 · App. 09/916,837
Semiconductor wafer, semiconductor device and manufacturing method therefor
Inventor:
Yuichi Miyagawa
Patented Case
View Patent ↗
Granted: May 13, 2003
Filed: Jul 26, 2001
Inventor
Yuichi Miyagawa
Assignee (at issue)
NEC Electronics Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.