Granted Patent
Utility
US 6,563,340 · App. 09/862,668
Architecture for implementing two chips in a package
Inventor:
Christopher W. Jones
Patented Case
View Patent ↗
Granted: May 13, 2003
Filed: May 21, 2001
Inventor
Christopher W. Jones
Assignee (at issue)
Cypress Semiconductor Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.