Granted Patent
Utility
US 6,565,365 · App. 09/850,626
High density wirebond connector assembly
Inventor:
Daniel A. Lawlyes
Patented Case
View Patent ↗
Granted: May 20, 2003
Filed: May 7, 2001
Inventor
Daniel A. Lawlyes
Assignee (at issue)
Delphi Technologies
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.