Granted Patent
Utility
US 6,565,416 · App. 09/805,860
Laser interferometry endpoint detection with windowless polishing pad for chemical mechanical polishing process
Inventors:
Samuel V. Dunton, Yizhi Xiong
Patented Case
View Patent ↗
Granted: May 20, 2003
Filed: Mar 13, 2001
Inventors
Samuel V. Dunton
Yizhi Xiong
Assignee (at issue)
KONINKLIJKE PHILIPS ELECTRONICS NV
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.