Granted Patent
Utility
US 6,566,736 · App. 09/998,624
Die seal for semiconductor device moisture protection
Inventors:
Hiroyuki Ogawa, Yider Wu, Yu Sun
Patented Case
View Patent ↗
Granted: May 20, 2003
Filed: Nov 30, 2001
Inventors
Hiroyuki Ogawa
Yider Wu
Yu Sun
Assignees (at issue)
Advanced Micro Devices, Inc.
Fujitsu Limited
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.