Granted Patent
Utility
US 6,566,758 · App. 09/995,168
Current crowding reduction technique for flip chip package technology
Inventors:
Pradeep Trivedi, Tyler Thorp, Sudhakar Bobba, Dean Liu
Patented Case
View Patent ↗
Granted: May 20, 2003
Filed: Nov 27, 2001
Inventors
Pradeep Trivedi
Tyler Thorp
Sudhakar Bobba
Dean Liu
Assignee (at issue)
Sun Microsystems Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.