IP Library Granted Patent US 6,567,963
Granted Patent Utility
US 6,567,963 · App. 09/693,664

Wafer scale integration and remoted subsystems using opto-electronic transceivers

Inventor: John Trezza
Patented Case View Patent ↗
Granted: May 20, 2003 Filed: Oct 20, 2000
Inventor
John Trezza
Assignee (at issue)
Teraconnect, Inc.

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Quick Facts
Patent No.
US 6,567,963
App. No.
09/693,664
Filed
2000-10-20
Granted
2003-05-20
Kind
B1