Granted Patent
Utility
US 6,568,384 · App. 09/587,896
Semiconductor material cutting and processing method
Inventor:
Kazunori Onizaki
Patented Case
View Patent ↗
Granted: May 27, 2003
Filed: Jun 6, 2000
Inventor
Kazunori Onizaki
Assignee (at issue)
SUMITOMO METAL INDUSTRIES, LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.