Granted Patent
Utility
US 6,569,262 · App. 09/511,478
Lead-free solder powder material, lead-free solder paste and a method for preparing same
Inventor:
Ikuo Shohji
Patented Case
View Patent ↗
Granted: May 27, 2003
Filed: Feb 23, 2000
Inventor
Ikuo Shohji
Assignee (at issue)
International Business Machines Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.