Granted Patent
Utility
US 6,569,740 · App. 09/593,103
Method of forming a semiconductor device having a buffer
Inventor:
Jeremy C. Smith
Patented Case
View Patent ↗
Granted: May 27, 2003
Filed: Jun 13, 2000
Inventor
Jeremy C. Smith
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.