Granted Patent
Utility
US 6,570,221 · App. 08/097,183
Bonding of silicon wafers
Inventor:
Derryl D. J. Allman
Patented Case
View Patent ↗
Granted: May 27, 2003
Filed: Jul 27, 1993
Inventor
Derryl D. J. Allman
Assignee (at issue)
Hyundai Electronics America
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.