Granted Patent
Utility
US 6,570,246 · App. 10/064,110
Multi-die package
Inventors:
Tzung-Han Lee, Kun-Chi Lin
Patented Case
View Patent ↗
Granted: May 27, 2003
Filed: Jun 12, 2002
Inventors
Tzung-Han Lee
Kun-Chi Lin
Assignee (at issue)
WINBOND ELECTRONICS CORP.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.