Granted Patent
Utility
US 6,570,263 · App. 10/162,912
Structure of plated wire of fiducial marks for die-dicing package
Inventors:
Kai-Chiang Wu, Yi-Liang Peng, Ya-Yun Cheng
Patented Case
View Patent ↗
Granted: May 27, 2003
Filed: Jun 6, 2002
Inventors
Kai-Chiang Wu
Yi-Liang Peng
Ya-Yun Cheng
Assignee (at issue)
Vate Technology Co., Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.