Granted Patent
Utility
US 6,571,466 · App. 09/536,830
Flip chip image sensor package fabrication method
Inventors:
Thomas P. Glenn, Steven Webster, Roy Dale Hollaway
Patented Case
View Patent ↗
Granted: Jun 3, 2003
Filed: Mar 27, 2000
Inventors
Thomas P. Glenn
Steven Webster
Roy Dale Hollaway
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.