Granted Patent
Utility
US 6,573,122 · App. 10/106,927
Wafer level insulation underfill for die attach
Inventor:
Martin Standing
Patented Case
View Patent ↗
Granted: Jun 3, 2003
Filed: Mar 26, 2002
Inventor
Martin Standing
Assignee (at issue)
International Rectifier Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.