Granted Patent
Utility
US 6,573,156 · App. 10/020,050
Low defect method for die singulation and for structural support for handling thin film devices
Inventors:
David Xuan-Qi Wang, Jason Yao
Patented Case
View Patent ↗
Granted: Jun 3, 2003
Filed: Dec 13, 2001
Inventors
David Xuan-Qi Wang
Jason Yao
Assignee (at issue)
OMM, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.