Granted Patent
Utility
US 6,573,158 · App. 09/991,747
Methods of processing semiconductor wafer and producing IC card, and carrier
Inventors:
Toshio Miyamoto, Kunihiro Tsubosaki, Mitsuo Usami
Patented Case
View Patent ↗
Granted: Jun 3, 2003
Filed: Nov 26, 2001
Inventors
Toshio Miyamoto
Kunihiro Tsubosaki
Mitsuo Usami
Assignee (at issue)
HITACHI, LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.