Granted Patent
Utility
US 6,573,173 · App. 10/175,637
Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process
Inventors:
János Farkas, Brian G. Anthony, Abbas Guvenilir, Mohammed Rabiul Islam, Venkat R. Kolagunta, John Mendonca, Rajesh Tiwari, Suresh Venkatesan
Patented Case
View Patent ↗
Granted: Jun 3, 2003
Filed: Jun 20, 2002
Inventors
János Farkas
Brian G. Anthony
Abbas Guvenilir
Mohammed Rabiul Islam
Venkat R. Kolagunta
John Mendonca
Rajesh Tiwari
Suresh Venkatesan
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.