Granted Patent
Utility
US 6,574,107 · App. 09/791,629
Stacked intelligent power module package
Inventors:
O-seob Jeon, Gi-young Jeon, Seung-yong Choi, Seung-won Lim, Seung Jin Kim, Eul-bin Im, Byeong Gon KIM
Patented Case
View Patent ↗
Granted: Jun 3, 2003
Filed: Feb 26, 2001
Inventors
O-seob Jeon
Gi-young Jeon
Seung-yong Choi
Seung-won Lim
Seung Jin Kim
Eul-bin Im
Byeong Gon KIM
Assignee (at issue)
Fairchild Korea Semiconductor Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.