IP Library Granted Patent US 6,574,859
Granted Patent Utility
US 6,574,859 · App. 09/785,787

Interconnection process for module assembly and rework

Inventors: Shaji Farooq, Mario J. Interrante, Sudipta K. Ray, William E. Sablinski
Patented Case View Patent ↗
Granted: Jun 10, 2003 Filed: Feb 16, 2001
Inventors
Shaji Farooq
Mario J. Interrante
Sudipta K. Ray
William E. Sablinski
Assignee (at issue)
International Business Machines Corporation

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Quick Facts
Patent No.
US 6,574,859
App. No.
09/785,787
Filed
2001-02-16
Granted
2003-06-10
Kind
B2