Granted Patent
Utility
US 6,574,861 · App. 09/832,779
System and method for solder ball rework
Inventors:
Hong Yang, Laxminarayan Sharma
Patented Case
View Patent ↗
Granted: Jun 10, 2003
Filed: Apr 11, 2001
Inventors
Hong Yang
Laxminarayan Sharma
Assignee (at issue)
APPLIED MICRO CIRCUITS CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.