Granted Patent
Utility
US 6,575,352 · App. 09/910,905
Apparatus and method for soldering electronic components to printed circuit boards
Inventors:
Kazushi Takahashi, Hiroshi Ohuchi
Patented Case
View Patent ↗
Granted: Jun 10, 2003
Filed: Jul 24, 2001
Inventors
Kazushi Takahashi
Hiroshi Ohuchi
Assignee (at issue)
SENJU METAL INDUSTRY CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.